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Semiconductor Wafer Manufacturing
Semiconductor wafers are the substrate material for chip manufacturing. Main substrates include hard and brittle single-crystal materials such as silicon, silicon carbide, gallium arsenide, indium phosphide, and sapphire. The process from single-crystal ingot to finished wafer involves slicing, edge chamfering, lapping, etching, and chemical mechanical polishing.
Sliced wafers have sharp edges with chipping defects that must be rounded using diamond grinding wheels. The edge is profiled to a controlled radius to prevent edge chipping and wafer breakage during subsequent processes.
Lean Abrasives's diamond grinding wheels are available in resin bond and metal bond systems, with grit sizes from 400# to 10000#, covering wafer edge chamfering, orientation notch grinding, and both coarse and fine back-thinning operations.
Our diamond wheels feature optimized bond formulations for hard and brittle materials such as SiC and sapphire, maintaining high grinding efficiency while reducing edge chipping and sub-surface damage, keeping wafer total thickness variation and warp within specification.
